Semiconductor manufacturing equipment and heater structural connection

A heater structural connection that produces heat by applying a voltage between a first electrode and a second electrode, the heater structural connection comprising:

• a heater including a heater element part, a first connection part, and a second connection part,
• wherein the heater element part is configured to heat a wafer from a rear surface of the wafer;
• the first connection part configured to be connected with and fixed to the first electrode, the first connection part being integrated with the heater element part and being projected from a rear surface of the heater element part, wherein a first contact surface between the first electrode and the first connection part is perpendicular to the rear surface of the heater element part;
• and
• the second connection part configured to be connected with and fixed to the second electrode, the second connection part integrated with the heater element part and being projected from the rear surface of the heater element part, wherein a second contact surface between the second electrode and the second connection part is respectively perpendicular to the rear surface of the heater element part and the first contact surface;
• wherein the first connection part and the first electrode are movable in the first contact surface;
• and
• the second connection part and the second electrode are movable in the second contact surface.