Power semiconductor package with bottom surface protrusions
AssigneePower Integrations, Inc.
InventorsBalu Balakrishnan, Brad L. Hawthorne, Stephan Bäurle
Life of this patent
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Abstract
A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.
Claims16
A package for housing a power semiconductor device comprising:
- a body that encapsulates the power semiconductor device, the body having a first pair of opposing lateral sides, front and back sides, a top that provides a mounting surface for a heat sink, and a bottom surface,
- a single elongated protrusion extending outward from the bottom surface such that when the package is mounted to a printed circuit board (PCB) the single elongated protrusion contacts the PCB and the bottom surface lies at an angle or incline in relation to a surface of the PCB after assembly;
- and
- a plurality of leads that extend outward from at least the first pair of opposing lateral sides, each of the leads having a substantially constant width over a length that extends from the body to a point through an insertion hole of the PCB when the package is mounted to the PCB.
A package for housing a power semiconductor die comprising:
- a body that encapsulates the power semiconductor device, the body having a first pair of opposing lateral sides, front and back sides, a top that provides a mounting surface for a heat sink, and a bottom surface,
- a plurality of non-conductive protrusions that extends outward from the bottom surface such that when the package is mounted to a printed circuit board (PCB) the non-conductive protrusions contact the PCB, at least one of the non-conductive protrusions having a different height as compared to a remaining number of the non-conductive protrusions such that the bottom surface lies at an angle or incline in relation to a surface of the PCB after assembly;
- and
- a plurality of leads that extend outward from at least the first pair of opposing lateral sides, each of the leads having a substantially constant width over a length that extends from the body to a point through an insertion hole of the PCB when the package is mounted to the PCB, wherein each of the leads is separated from an adjacent one of the leads by a distance that is substantially constant over the length.
Dependencies are inferred from the claim text.