Method and apparatus adapted to prevent code data from being lost in solder reflow
AssigneeSamsung Electronics Co., Ltd.
InventorsJin Hyoung Kwon, Hui Kwon Seo
Life of this patent
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Abstract
A semiconductor device comprises a first non-volatile memory configured to store program code and a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory after a solder reflow process. The processor typically copies the program code from the first non-volatile memory to the second non-volatile memory after the processor is completely booted.
Claims17
A method of managing program code in a semiconductor device comprising a first non-volatile memory and a second non-volatile memory separate from the first non-volatile memory device, the method comprising:
- writing the program code to the first non-volatile memory before a solder reflow process is performed to connect the semiconductor device to a substrate;
- copying the program code from the first non-volatile memory to a second non-volatile memory after the solder reflow process is performed;
- operating a central processing unit (CPU) to store the program code in a shared memory bank of a multi-port memory device;
- and
- operating a processor to copy the program code from the shared memory bank to a second memory bank of the multi-port memory device, and then to write the program code from the shared memory bank to the first non-volatile memory, which is different from the multi-port memory device.
A semiconductor device comprising:
- a first non-volatile memory configured to store program code;
- a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory separate from the first non-volatile memory after a solder reflow process is performed to connect the semiconductor device to a substrate;
- and
- a multiport memory device comprising a shared bank memory accessed by a central processing unit (CPU) or the processor according to an access authority, wherein the CPU outputs the program code and controls writing of the program code to the shared bank memory and the processor controls writing of the program code from the shared bank memory to the first non-volatile memory, which is different from the multi-port memory device.
A semiconductor system comprising:
- a semiconductor device;
- and
- a central processing unit (CPU) configured to control operation of the semiconductor device,
- wherein the semiconductor device comprises:
- a first non-volatile memory configured to store a program code;
- and
- a processor configured to copy the program code from the first non-volatile memory to a second non-volatile memory separate from the first non-volatile memory after a solder reflow process is performed to connect the semiconductor memory device to a substrate;
- wherein the semiconductor device further comprises:
- a first memory bank configured to be accessed by the CPU;
- a second memory bank configured to be accessed by the processor;
- and
- a shared memory bank different from the first non-volatile memory and configured to be accessed by the CPU or the processor according to an access authority,
- wherein the program code is input to the semiconductor device and written to the shared memory bank, and processor controls writing of the program code from the shared memory bank to the first non-volatile memory.
Dependencies are inferred from the claim text.