Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

An electronic device comprising:

• a central processing unit;
• an assembly electrically coupled to the central processing unit, the assembly including:
• a substrate having first and second surfaces and a through hole extending from the first surface to the second surface;
• a microelectromechanical (MEMS) sensor integrated in a first die of semiconductor material and configured to sense a change in capacitance;
• an electronic circuit integrated in a second die of semiconductor material, the electronic circuit operatively coupled to said MEMS sensor, the first die being stacked on the second die and the second die located on the first surface of the substrate, the second die having a plurality of through holes that are located above with the through hole of the substrate and places a portion of the MEMS sensor in fluid communication with an external environment;
• and
• a cap coupled to the first surface of the substrate and covering the first die and the second die and forming a cavity therebetween.

A method comprising:

• stacking a first die of semiconductor material that integrates an electronic circuit and has a plurality of through holes onto a first surface of a substrate, the substrate having a through hole, the stacking including aligning the plurality of through holes of the first die with the through hole of the substrate;
• stacking a microelectromechanical (MEMS) sensor integrated in a second die of semiconductor material and configured to sense a change in capacitance on to the first die of semiconductor material, the stacking including aligning a membrane of the second die with the plurality of through holes of the first die and with the through hole of the substrate, wherein the plurality of through holes of the first die and the through of the substrate place the membrane in fluid communication with an environment outside of the stack;
• electrically coupling the MEMS of the second die to the electronic circuit of the first die;
• and
• covering the second die and at least a portion of the first die by coupling a cap to the first surface of the substrate.