Methods and systems for providing a low stress electrode connection

A laser diode stack comprising:

• a number of laser diode systems, each laser diode system comprising:
• a cooling component;
• the cooling component having a number of groups of attachment locations;
• each group of attachment locations configured to receive one push attachment component and one pull attachment component and having three attachment locations;
• the three attachment locations being disposed substantially sequentially;
• the cooling component being in one of two configurations;
• in a first configuration, a first attachment location in each group of attachment locations being configured to receive a pull attachment component;
• in a second configuration, a last attachment location in each group of attachment locations being configured to receive a pull attachment component;
• and
• a laser diode disposed on the cooling component;
• an anode of the laser diode being electrically coupled and attached to the cooling component;
• and
• at least one insulating component;
• said at least one insulating component being disposed over the cooling component on a surface on which the laser diode is disposed on;
• the at least one insulating component configured to hold a water inlet seal and a water outlet seal;
• said at least one insulating component being disposed away from the laser diode and the number of groups of attachment locations;
• wherein said at least one insulating component is located between each two consecutive laser diode systems in the laser diode stack;
• wherein said at least one insulating component is configured such that a cathode of the laser diode in one laser diode system is in direct electrical connection with the cooling component of another laser diode system;
• and wherein the cooling component of the one laser diode system is of one of the two configurations and the cooling component of said another laser diode system is of another configuration from the two configurations.

A method for forming a low stress electrical connection for carrying a high electrical current in a laser diode system, the method comprising:

• placing a laser diode on a cooling component;
• an anode of the laser diode being electrically coupled and attached to the cooling component;
• attaching the cooling component to a base component;
• the base component being electrically connected to the cooling component;
• disposing a mechanical support component on the base component;
• the mechanical support component surrounding the cooling component and the laser diode and being electrically isolated from the cooling component and the base component;
• and
• placing a connection plate component over a cathode of the laser diode and over the mechanical support component;
• the connection plate component being configured to be mechanically attached to the mechanical support component by means of a push attachment component and a pull attachment component;
• wherein the push attachment component and the pull attachment component are configured to provide substantially controlled position of the connection plate component to the mechanical support component;
• the connection plate component being electrically connected to the mechanical support component and the cathode of the laser diode.

A method for forming a low stress electrical connection in a laser diode stack, the method comprising:

• incorporating at least one mechanical adjustment mechanism in each laser diode system of a number of laser diode systems in the laser diode stack;
• the at least one mechanical adjustment mechanism comprising one push attachment component and one pull attachment component;
• said each laser diode system comprising a cooling component and a laser diode disposed in the cooling component;
• an anode of the laser diode being electrically coupled and attached to the cooling component;
• and
• disposing an insulating component between each two consecutive laser diode systems in the laser diode stack;
• the insulating component being configured such that a cathode of the laser diode in one laser diode system is in direct electrical connection with the cooling component of another laser diode system when the insulating component is disposed between the one laser diode system and the another laser diode system.