Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure

A method for manufacturing a terminal structure, the method comprising:

• a step of preparing a terminal structure including a solder joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer;
• a step of measuring the indentation elastic modulus of the conductor region;
• a step of measuring the indentation elastic modulus of the intermediate layer;
• a step of judging whether resistance to drop impact of the terminal structure is favorable based on a value of the indentation elastic modulus of the conductor region and a value of the indentation elastic modulus of the intermediate layer;
• and
• a step of producing a terminal structure under the same condition as a production condition of the terminal structure that has been judged to show favorable resistance to drop impact at the step of judging.