Low inductance capacitor module and power system with low inductance capacitor module
AssigneeInfineon Technologies AG
InventorsDaniel Domes, Reinhold Bayerer
Life of this patent
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Abstract
According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.
Claims19
A capacitor module, comprising:
- a substrate having a metallization on a first side of the substrate;
- a plurality of connectors electrically coupled to the metallization;
- a plurality of capacitors disposed on the metallization and including a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors;
- and a housing enclosing the plurality of capacitors within the capacitor module so that the capacitors are enclosed on all sides, wherein at least some of the plurality of connectors extend through the housing so that part of these connectors is outside the housing;
- wherein the substrate comprises a ceramic substrate with the metallization disposed on a first side of the ceramic substrate and an additional metallization disposed on a second opposing side of the ceramic substrate, and wherein at least part of the additional metallization is exposed through an opening in the housing.
A power system, comprising:
- a cooler;
- a capacitor module on the cooler, the capacitor module comprising:
- a substrate having a metallization on a first side of the substrate;
- a plurality of connectors electrically coupled to the metallization;
- a plurality of capacitors disposed on the metallization and including at least a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors;
- and a housing enclosing the plurality of capacitors within the capacitor module so that the capacitors are enclosed on all sides, wherein at least some of the plurality of connectors extend through the housing so that part of these connectors is outside the housing;
- a power semiconductor module on the cooler;
- and an electrical connection medium electrically connected to the capacitor module through the part of the connectors that extend outside the housing and to the power semiconductor module;
- wherein the electrical connection medium is a printed circuit board.
Dependencies are inferred from the claim text.