Die processing method, die, objective lens, and optical pick-up device
AssigneeKonica Minolta Opto, Inc.
InventorsKenichi Ishii, Kyu Takada
Life of this patent
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AssigneeKonica Minolta Opto, Inc.
InventorsKenichi Ishii, Kyu Takada
Estimating the term…
A method for processing a material for a die for molding an objective lens which is formed with a multilevel structure on the curved surface thereof, wherein the transfer surface of the objective lens is cut by a tool having a cutting face, the outline of which includes a linear first edge portion, a linear second edge portion extending in a direction which intersects the first edge portion at an acute angle thereto, and a third edge portion which joins the ends of the first and second edge portions, while the die material is rotated around the axis thereof, in a state in which at least the first edge portion and the second edge portion of the tool is inclined with respect to the axis and while the tool is moved only in the axial direction and in the direction which intersects the axis.
An objective lens used for an optical pick-up device compatible with different types of optical disks and to focus a light flux onto an information recording surface of each of the optical disks, comprising:
Dependencies are inferred from the claim text.