Grazing and normal incidence interferometer having common reference surface
AssigneeKLA-Tencor Corporation
InventorsDieter Muller, Daniel Kavaldjiev, Rainer Schierle
Life of this patent
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AssigneeKLA-Tencor Corporation
InventorsDieter Muller, Daniel Kavaldjiev, Rainer Schierle
Estimating the term…
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes-means for stitching scans together, providing for smaller and less expensive optical elements.
A method for measuring specimen thickness variations in a specimen having at least two sides, the method comprising:
A method for measuring thickness variations of a specimen comprising a plurality of sides, the method comprising:
A specimen thickness measurement method, comprising:
Dependencies are inferred from the claim text.