Semiconductor device having a plurality of pads
AssigneeSamsung Electronics Co., Ltd.
InventorsKab Yong Kim, Hyun Soon Jang, Yong Hwan Jeong
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Abstract
A semiconductor device includes a plurality of sensor pads configured to receive a probe signal from a testing apparatus, and a plurality of normal pads configured to receive a driving signal to drive the semiconductor device. In the plurality of sensor pads and the plurality of normal pads, a length in a direction corresponding to one of progress directions of a plurality of needles of the testing apparatus is longer than a length in another progress direction of the plurality of needles.
Claims13
A semiconductor device having a plurality of pads, the semiconductor device comprising:
- a plurality of sensor pads configured to receive a probe signal from a testing apparatus;
- and
- a plurality of normal pads configured to receive a driving signal to drive the semiconductor device,
- wherein the plurality of sensor pads and the plurality of normal pads include individual sensor pads and normal pads that each have a length in a direction corresponding to one of progress directions of a plurality of needles of the testing apparatus that is longer than a length in another progress direction of the plurality of needles.
A method of performing a needle alignment check on a wafer, comprising:
- providing a probe signal from a testing apparatus to a plurality of sensor pads on the wafer;
- and
- providing a signal for the testing apparatus to a plurality of normal pads on the wafer,
- wherein the plurality of sensor pads and the plurality of normal pads include sensor pads and normal pads that each have a length in a direction corresponding to one of progress directions of a plurality of needles of the testing apparatus that is longer than a length in another progress direction of the plurality of needles.
Dependencies are inferred from the claim text.