US 8,786,301 B1 · Apparatus for a low-cost semiconductor test interface system

Abstract

A system for testing a device under test (DUT), in which electrical coupling among a module board, a low profile connector, and, a DIB is established by applying a pressure on the module board toward the DUT, is provided. The system includes a test head bracket secured inside a test head, the test head bracket includes the module board having a first section including a plurality of connectors to couple a test analyzer to the module board, a second section including a plurality of contacts pads to electrically couple the module board to the DUT, and, a flexible board to enable the first section to be placed at an angle with respect to the second section. The test head bracket also includes a module board stiffener mechanically securing the first section and the second section to the test head and the low profile connector electrically couples the module board to the DUT.

Claims20

Dependent claims

A low profile device under test (DUT) connector comprising:

a block composed of an electrically non-conducting material, the block defining a grid having a plurality of connector wires for testing various types of DUTs via a solderless electrical connection between the plurality of connector wires and first associated contact pads of a module board, and via a temporary electrical connection between the plurality of connector wires and second associated contact pads of a device interface board, wherein each connector wire includes a top section, a bottom section, and a middle section, and wherein the top section and the bottom section of each connector wire is curved with respect to the middle section, and wherein each connector wire has a first angle of curvature from the middle section to a tip of the top section and has a second angle of curvature from the middle section to a tip of the bottom section, the first angle differing from the second angle by about ninety degrees.

A low profile DUT connector, comprising:

an electrically non-conductive block of material;
a plurality of holes extending through the block of material;
and
a plurality of connector wires extending through some of the plurality of holes of the low profile DUT connector, the plurality of connector wires configured for testing various types of DUTs via a temporary electrical connection between the plurality of connector wires and associated contact pads of a device interface board while the plurality of connector wires make solderless electrical connection to associated contact pads of a module board, wherein each connector wire of the plurality of connector wires has a top section having a first tip that makes an angle of about ninety degrees with a middle section of the connector wire, a portion of the top section extending beyond a top surface of the block of material and wherein each connector wire of the plurality of connector wires has a bottom section having a second tip that makes an angle of about one hundred and eighty degrees with the middle section of the connector wire, a portion of the bottom section extending beyond a bottom surface of the block of material, the middle section halfway between the top section and the bottom section.

1 more element

Dependencies are inferred from the claim text.

Apparatus for a low-cost semiconductor test interface system

Life of this patent

Apparatus for a low-cost semiconductor test interface system

Life of this patent

Abstract

Claims20