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US 8,786,180 B2Granted
Display device
AssigneeLC Display Co., Ltd.
InventorsEunah Song, Myungseop Kim, Sunhee Lee
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Abstract
A display device is discussed. According to an embodiment, the display device includes a substrate; a first electrode positioned on the substrate; a second electrode; an organic emission layer interposed between the first electrode and the second electrode; an organic insulating film positioned on the second electrode and surrounding an emission area emitting light from the organic emission layer; and a passivation film covering the organic insulating film.
Claims14
A display device comprising:
- a substrate;
- a first electrode positioned on the substrate;
- a bank layer positioned on the first electrode to expose part of the first electrode and define a pixel;
- a second electrode;
- an organic emission layer interposed between the first electrode and the second electrode;
- an organic insulating film positioned on the second electrode and in a peripheral area other than an emission area emitting light from the organic emission layer;
- a passivation film covering the organic insulating film, and an encapsulation substrate bonded to the substrate wherein a filling agent is formed between the substrate and the encapsulation substrate to thus bond the substrate and the encapsulation substrate together
- wherein the organic insulating film is excluded from the emission area, and
- wherein the second electrode is interposed between the bank layer and the organic insulating film.
6 more elements
A display device comprising:
- a substrate;
- a first electrode positioned on the substrate;
- a second electrode;
- an organic emission layer interposed between the first electrode and the second electrode;
- a second passivation film positioned on the second electrode;
- an organic insulating film positioned on the second passivation film and in a peripheral area other than an emission area emitting light from the organic emission layer;
- a first passivation film covering the second passivation film and the organic insulating film, and an encapsulation substrate bonded to the substrate wherein a filling agent is formed between the substrate and the encapsulation substrate to thus bond the substrate and the encapsulation substrate together
- wherein the organic insulating film is excluded from the emission area.
5 more elements
Dependencies are inferred from the claim text.