Method of forming an electromechanical power switch for controlling power to integrated circuit devices and related devices

A semiconductor device comprising:

• a semiconductor substrate;
• at least one integrated circuit device on a front surface of the semiconductor substrate, wherein the at least one integrated circuit device includes at least one circuit block and at least one power switch circuit;
• a dielectric layer on the at least one integrated circuit device;
• a first electromechanical power switch on the dielectric layer, wherein the first electromechanical power switch gates a voltage supply to the at least one circuit block;
• and
• a second electromechanical power switch on the dielectric layer, wherein the second electromechanical power switch gates a voltage supply to the at least one integrated circuit device;
• wherein the first electromechanical power switch is actuated using the at least one power switch circuit, and wherein the at least one circuit block is switched off in response to the first electromechanical power switch being actuated.

A data processing system comprising:

• a system bus;
• at least one interface device in communication with the system bus;
• a power management unit in communication with the system bus;
• a first electromechanical power switch in communication with the power management unit;
• a second electromechanical power switch in communication with the power management unit;
• and
• at least one circuit block in communication with the first electromechanical power switch;
• wherein the first electromechanical power switch gates a voltage supply to the at least one circuit block and the second electromechanical power switch gates a voltage supply to the data processing system;
• and
• wherein the first electromechanical power switch is actuated by the power management unit, and wherein the at least one circuit block is switched off in response to the first electromechanical power switch being actuated.