Semiconductor device and manufacturing method thereof

A stacked type semiconductor device comprising:

• a support plate;
• a first semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes;
• a first insulation layer covering the circuit element surface of the first semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes;
• a second insulation layer covering an upper part of the support plate and side parts of the first semiconductor element and side parts of the first insulation layer;
• wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes;
• a third insulation layer formed above the semiconductor device and including a plurality of second apertures partially exposing the wirings;
• a second semiconductor element stacked on the semiconductor device with the third insulation layer interposed between the second semiconductor element and the semiconductor device;
• a fourth insulation layer covering the circuit element surface of the second semiconductor element, and including a plurality of third apertures exposing a plurality of second electrodes;
• a fifth insulation layer covering an upper part of the third insulation layer and side parts of the second semiconductor element, and including a plurality of fourth apertures above the second apertures;
• a plurality of conduction layers formed within the plurality of second apertures of the third insulation layer and being electrically connected to the wirings of the semiconductor device and to a wiring of the second semiconductor element;
• and
• a metal layer formed between the semiconductor device and the third insulation layer, and partially covering an upper surface of the semiconductor device.

A stacked type semiconductor device comprising:

• a support plate;
• a first semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes;
• a first insulation layer covering the circuit element surface of the first semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes;
• a second insulation layer covering an upper part of the support plate and side parts of the first semiconductor element and side parts of the first insulation layer;
• wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes;
• a third insulation layer formed above the semiconductor device and including a plurality of second apertures partially exposing the wirings;
• a metal layer formed partially on the third insulation layer, except for the second apertures;
• a fourth insulation layer formed above the metal layer and including a plurality of third apertures partially exposing the metal layer, and also above the second apertures;
• a second semiconductor element stacked on the semiconductor device with the fourth insulation layer interposed between the semiconductor device and the second semiconductor element;
• a fifth insulation layer covering the circuit element surface of the second semiconductor element, and including a plurality of fourth apertures exposing a plurality of second electrodes;
• a sixth insulation layer covering an upper part of the third insulation layer and side parts of the second semiconductor element, and including a plurality of fifth apertures above the second and third apertures;
• a plurality of conduction poles formed within the plurality of second, fifth and third apertures of the third, sixth and fourth insulation layers, respectively, and being electrically connected to the wirings of the semiconductor device and the metal layer;
• and
• second wirings formed on an upper part of the fifth insulation layer and on an upper part of the sixth insulation layer and electrically connected to the second electrodes and the plurality of conduction poles, and some wirings connect between the second electrodes and the plurality of conduction poles.