Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

An electronic apparatus comprising:

• a first semiconductor component including
• a first electronic part including a first electrode pad forming surface on which a first electrode pad is formed, and a first back surface opposing the first electrode pad forming surface,
• a first insulation member including one surface and an opposing surface, the first insulation member sealing a side surface of the first electronic part,
• a first multilayer wiring structure including plural insulation layers that are stacked one above another and a first patterned wiring, and
• a first through electrode including an end part and configured to go through the first insulation member,
• wherein the first patterned wiring is connected to the first electrode pad and the first through electrode;
• a second semiconductor component including
• a second electronic part including a second electrode pad forming surface on which a second electrode pad is formed, and a second back surface opposing the second electrode pad forming surface,
• a second insulation member including one surface and an opposing surface, the second insulation member sealing a side surface of the second electronic part,
• a second multilayer wiring structure including plural insulation layers that are stacked one above another and a second patterned wiring, and
• a second through electrode that is provided on an inner surface of a first through hole formed to go through the second insulation member and the second multilayer wiring structure, and includes a second through hole formed in a center portion of the second through electrode,
• wherein the second patterned wiring is connected to the second electrode pad and the second through electrode;
• an adhesion layer provided between the opposing surface of the first insulation member and the second multilayer wiring structure;
• and
• a third through electrode configured to fill the second through hole and a third through hole that is formed integrally with the second through hole in the adhesion layer;
• wherein the first multilayer wiring structure is formed on the one surface of the first insulation member;
• wherein the one surface of the first insulation member is substantially flush with the first electrode pad forming surface,
• wherein the third through electrode has first and second ends, the first end of the third through electrode including an external connection pad portion that is protruded from the second insulation member, the second end of the third through electrode being connected to the end part of the first through electrode,
• wherein the third through hole is configured to expose the end part of the first through electrode,
• wherein the external connection pad portion is wider than a diameter of the second through hole.