Wiring substrate and semiconductor package

A wiring substrate comprising:

• a substrate body made of an inorganic material;
• a first electrode portion, having a rectangular plane shape, which penetrates through the substrate body in a thickness direction of the substrate body;
• a second electrode portion, having a rectangular plane shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval;
• and
• a signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction,
• wherein:
• the first electrode portion is a ground electrode, and the second electrode portion is a power electrode;
• the first electrode portion includes a plurality of ground electrodes;
• the second electrode portion includes a plurality of power electrodes;
• the ground electrodes and the power electrodes are arranged alternately at prescribed intervals in each of an X direction and a Y direction which are perpendicular to each other;
• the signal electrode is interposed between one of the ground electrodes and one of the power electrodes which are opposed to each other;
• and
• the signal electrode has a circular plane shape.