Semiconductor package and method of forming

A process for manufacturing a semiconductor package, the process comprising:

• providing a plurality of supports arranged in a matrix on a larger support, each support having electrically conductive paths;
• providing a semiconductor die having bond-pads;
• then attaching said semiconductor die to one of said plurality of supports;
• then electrically connecting a bond-pad of the semiconductor die to an electrically conductive path by a bond-wire of an alloy of copper at 99% purity,
• wherein the electrically conductive paths of said plurality of supports are all electrically connected together and the process further comprises electroplating a layer of a second metallic composition onto the bond-wire and the connection junction;
• and
• wherein electroplating comprises electroplating a layer of titanium onto the bond-wire and the connection junction and then electroplating a layer of nickel onto the layer of titanium.