Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity

A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity, the packaging device comprising:

• a metal base having a supporting surface with a first electrode area and a second electrode area disposed thereon, said first electrode area and said second electrode area being electrically isolated via an insulating structure;
• an array chip disposed on said first electrode area, wherein a plurality of matrix-arranged semiconductor light-emitting elements and at least two wire bond pads adjacent to said light-emitting elements are disposed on an active side of said array chip, wherein said light-emitting elements are arranged as a tetragon and said at least two wire bond pads are distributed on different sides of said tetragon;
• a conductive adhesive applied between a bottom surface of said array chip and said first electrode area, facilitating an electrical connection between said bottom surface and said first electrode area;
• and
• a plurality of metal wires connected between said at least two wire bond pads and said second electrode area;
• wherein said light-emitting elements are chosen from one of the following:
• VCSEL elements, HCSEL elements and RCLED elements;
• wherein, a pole of said second electrode area is opposite to another pole of the first electrode area;
• said at least two wire bond pads are connected by the metal wires to said second electrode area and thus are of the same pole as said second electrode area;
• wherein the number of said second electrode area is one and a width of said second electrode area is larger than a width of said array chip.