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US 8,786,072 B2Granted
Semiconductor package
AssigneeInternational Rectifier Corporation
InventorMartin Standing
Life of this patent
Estimating the term…
Abstract
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive.
Claims13
A semiconductor package comprising:
- a semiconductor die that includes a first electrode on a surface thereof;
- a support plate having a first surface and a second surface opposite said first surface;
- an insulation body disposed directly on said first surface of said support plate;
- and
- a plurality of laterally spaced conductive pads disposed directly on said insulation body, a first one of said conductive pads including a first region electrically and mechanically coupled to said first electrode with a conductive adhesive body interposed between said first electrode and said first region and a second region readied for connection using a conductive adhesive body to a conductive pad external to said package;
- wherein said insulation body electrically insulates said plurality of laterally spaced conductive pads from said support plate.
3 more elements
Dependencies are inferred from the claim text.