Wiring pattern having a stub wire
AssigneeCanon Kabushiki Kaisha
InventorYoshitaka Kawase
Life of this patent
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Abstract
A pad for a line which supplies an electric power potential is disposed on a semiconductor integrated circuit and a pad which is not electrically connected to any other electric circuit is disposed on a semiconductor integrated circuit board, and the two pads are connected through a bonding wire. An LC resonant circuit is configured with ease using a floating capacitance C of the pad which is in an electrically open state and which is disposed in a vacant region and an inductance value L of the bonding wire which is disposed in a three-dimensional manner. High-frequency noise is filtered and high-density implementation is realized.
Claims4
A semiconductor device comprising:
- a semiconductor integrated circuit board;
- a semiconductor integrated circuit mounted on the semiconductor integrated circuit board;
- pads which are disposed on the semiconductor integrated circuit;
- and
- pads which are disposed on the semiconductor integrated circuit board and which are connected to the pads disposed on the semiconductor integrated circuit through bonding wires,
- wherein the bonding wires include,
- electric-power bonding wires, ground bonding wires, signal bonding wires and at least one stub wiring bonding wire, each of the electric-power bonding wires configured to connect an electric-power pad disposed on the semiconductor integrated circuit board to an electric-power ring pad disposed on a periphery of the semiconductor integrated circuit,
- the ground bonding wires configured to connect a ground pad disposed on the semiconductor integrated circuit board to a ground ring pad disposed on a periphery of the semiconductor integrated circuit,
- the signal bonding wires configured to connect a signal pad disposed on the semiconductor integrated circuit board to a signal pad disposed on the semiconductor integrated circuit, and
- the stub wiring bonding wire disposed on at least one of corner areas of the semiconductor integrated circuit, configured to connect an electric-power pad disposed on the semiconductor integrated circuit to a pad which is not electrically connected to any other electric circuit (non-connected pad) and which is disposed on the semiconductor integrated circuit board.
Dependencies are inferred from the claim text.