Reconfigurable pop

A microelectronic package, comprising:

• a lower package face, an upper package face opposite the lower package face, and peripheral package edges bounding the lower and upper package faces;
• lower terminals at the lower package face configured for connection with a first component,
• upper terminals at the upper package face configured for connection with a second component,
• first and second microelectronic elements each having memory storage array function, element faces of the first and second microelectronic elements arranged in a single plane parallel to the lower package face, the first and second microelectronic elements each having contacts at the respective element face;
• and
• conductive interconnects each electrically connecting at least one lower terminal with at least one upper terminal, at least some of the conductive interconnects electrically connected with the contacts of the microelectronic elements, the conductive interconnects including:
• first conductive interconnects configured to carry address information and including first and second sets of interconnects disposed on respective first and second opposite sides of a theoretical plane normal to the lower package face, signal assignments of the first set of interconnects having 180° rotational symmetry about a theoretical rotational axis of the microelectronic package with signal assignments of the second set of interconnects, the rotational axis being normal to the lower package face and extending in the theoretical plane;
• and
• second conductive interconnects configured to carry data information to and from one of the microelectronic elements and including third and fourth sets of interconnects disposed on the respective first and second sides of the theoretical plane, the position of each second conductive interconnect having 180° rotational symmetry about the rotational axis with a position of a corresponding no-connect conductive interconnect that is electrically insulated from the microelectronic elements within the microelectronic package.