Semiconductor package having improved heat spreading performance

A semiconductor package, comprising:

• a plurality of semiconductor chips arranged in a stack structure;
• a plurality of substrates having the semiconductor chips respectively attached thereto, each substrate having one or more vias, the plurality of substrates including an upper-most substrate of the semiconductor package;
• a plurality of solder balls arranged to provide voltages and signals to the plurality of semiconductor chips;
• a heat sink positioned to spread heat produced in the interior of the package to the outside, the heat sink connected to at least a first solder ball of the plurality of solder balls and positioned above the upper-most semiconductor chip of the semiconductor package;
• and
• an insulating layer positioned between the upper-most substrate and the heat sink,
• wherein a first via in the upper-most substrate extends along a line in a vertical direction from a bottom of the upper-most substrate toward a top of the upper-most substrate, and the first solder ball is disposed along the line, at least a second via is disposed in a second, lower substrate, and a second solder ball is disposed between and connects the first via and the second via, both the second via and second solder ball also extending along the line, and wherein the insulating layer includes a first hole or a first conductive layer which is vertically aligned with the first solder ball, the first via, the second solder ball, and the second via, and the first solder ball, and the first via, the second solder ball, and the second via are electrically connected to the heat sink through the first hole or the first conductive layer;
• and
• wherein the heat sing comprises a single heat sink, wherein the heat sink is the only heat sink positioned to dissipate heat generated by the first semiconductor chip through at least the first via and first solder ball, and to dissipate heat generated by the second semiconductor chip through at least the second via, second solder ball, first via, and the first solder ball.

A semiconductor package, comprising:

• a plurality of semiconductor chips arranged in a stack structure;
• a plurality of substrates having the semiconductor chips respectively attached thereto, each substrate having one or more vias, wherein the plurality of semiconductor chins include a top-most semiconductor chip of the package and a bottom-most semiconductor chip of the package;
• a plurality of solder balls arranged to provide voltages and signals to the plurality of semiconductor chips;
• and
• a heat sink positioned to spread heat produced in the interior of the package to the outside, the heat sink connected to at least a first solder ball of the plurality of solder balls,
• wherein a first via of the one or more vias is vertically aligned with the first solder ball and is connected with the first solder ball to be electrically connected to the heat sink through the first solder ball, whereby vertical alignment corresponds to a location of the first solder ball with respect to the first via,
• wherein the first solder ball and first via are positioned to pass heat generated by each of the plurality of semiconductor chips to the heat sink,
• wherein no heat sinks are disposed between the top-most semiconductor chip and the bottom-most semiconductor chip, the semiconductor package further comprising an insulating layer positioned between an upper-positioned substrate and the heat sink, wherein the insulating layer includes a first hole or a first conductive layer which is vertically aligned with the first solder ball and the first via, and the first solder ball and the first via are electrically connected to the heat sink through the first hole or the first conductive layer.