Substrate, light emitting device and method for manufacturing substrate

A light emitting device comprising:

• a first lead frame including a heat sink and a plurality of electrodes for external connection;
• a second lead frame laminated on the first lead frame and including a plurality of wirings;
• a resin layer filled between the first lead frame and the second lead frame;
• light emitting elements mounted on the wirings;
• and
• an encapsulating resin formed to encapsulate the light emitting elements, wherein
• the plurality of wirings is arranged above the heat sink,
• the plurality of electrodes and part of the plurality of wirings are joined with each other,
• the plurality of wirings of the second lead frame includes:
• a plurality of first wirings including connecting portions with the light emitting elements;
• and
• a pair of second wirings including connecting portions with the electrodes and the light emitting elements,
• the plurality of first wirings are arranged adjacent to one another in parallel between the pair of second wirings,
• upper surfaces of the first wirings and upper surfaces of the second wirings serve as mounting portions for the light emitting elements, and
• lower surfaces of the second wirings serve as connecting portions with the electrodes.

A substrate comprising:

• a first lead frame including a heat sink and a plurality of electrodes for external connection;
• a second lead frame laminated on the first lead frame and including a plurality of wirings for mounting light emitting elements;
• a resin layer filled between the first lead frame and the second lead frame;
• a first metal layer that forms lower surfaces of the electrodes exposed from a lower surface of the resin layer;
• and
• a second metal layer that forms upper surfaces of the wirings exposed from an upper surface of the resin layer,
• wherein the plurality of wirings are arranged above the heat sink, and
• the plurality of electrodes and part of the plurality of wirings are joined with each other.

A light emitting device comprising:

• a first lead frame including a heat sink and a plurality of electrodes for external connection;
• a second lead frame laminated on the first lead frame and including a plurality of wirings;
• a resin layer filled between the first lead frame and the second lead frame;
• light emitting elements mounted on the wirings;
• an encapsulating resin formed to encapsulate the light emitting elements;
• a first metal layer that forms lower surfaces of the electrodes exposed from a lower surface of the resin layer;
• and
• a second metal layer that forms upper surfaces of the wirings exposed from an upper surface of the resin layer, wherein
• the plurality of wirings are arranged above the heat sink, and
• the plurality of electrodes and part of the plurality of wirings are joined with each other.