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US 8,786,064 B2Granted
Semiconductor package and method for manufacturing the same and semiconductor package module having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Su Kim, Ji Man Ryu, Soon Gyu Yim
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.
Claims20
A semiconductor package comprising:
- a first substrate having top and bottom surfaces, a concave formed on the top surface thereof and an opening formed on a bottom surface of the concave;
- a second substrate having top and bottom surfaces, the bottom surface of the first substrate disposed on the top surface of the second substrate;
- a semiconductor chip having top and bottom surfaces, the bottom surface of the semiconductor chip mounted in the concave;
- and
- a bonding section interposed between the first substrate and the second substrate, the bonding section being made of solder.
2 more elements
A semiconductor package module, comprising:
- a first substrate having top and bottom surfaces, one or more concaves formed on the top surface thereof and an opening formed on a bottom surface of the concave;
- a second substrate having top and bottom surfaces, the bottom surface of the first substrate disposed on the top surface of the second substrate;
- a first semiconductor chip having top and bottom surfaces, the bottom surface of the first semiconductor chip mounted in the concave;
- and
- a bonding section interposed between the first substrate and the second substrate, the bonding section being made of solder,
- wherein one side of the first substrate protrudes from the second substrate to serve as an external connection terminal.
3 more elements
A semiconductor package module, comprising:
- a first substrate having a top surface and a bottom surface, one or more concaves formed on the top surface thereof and an opening formed on a bottom surface of the concave;
- a second substrate having a top surface and a bottom surface, the bottom surface of the first substrate disposed on the top surface of the second substrate;
- a third substrate having a top surface and a bottom surface, the bottom surface of the third substrate disposed on the top surface of the second substrate;
- and
- a first semiconductor chip having a top surface and a bottom surface, the bottom surface of the first semiconductor chip mounted in the concave,
- wherein one side of the first substrate protrudes from the second substrate to serve as an external connection terminal.
3 more elements
A semiconductor package module, comprising:
- a first substrate having a top surface and a bottom surface, one or more concaves formed on the top surface thereof and an opening formed on a bottom surface of the concave;
- a second substrate having a top surface and a bottom surface, the bottom surface of the first substrate disposed on the top surface of the second substrate;
- one or more first semiconductor chips having a top surface and a bottom surface, respectively, the bottom surfaces of the first semiconductor chips mounted in the concave;
- and
- a connection member area contacting the top surfaces of the first semiconductor chips and electrically connecting the first semiconductor chips mounted in the one or more concaves to each other;
- wherein one side of the first substrate protrudes from the second substrate to serve as an external connection terminal.
3 more elements
A semiconductor package module, comprising:
- a first substrate having a top surface and a bottom surface, one or more concaves formed on the top surface thereof and an opening formed on a bottom surface of the concave;
- a second substrate having a top surface and a bottom surface, the bottom surface of the first substrate disposed on the top surface of the second substrate;
- a first semiconductor chip having a top surface and a bottom surface, the bottom surface of the first semiconductor chip mounted in the concave;
- and
- a molding material formed to cover the top surfaces of the first semiconductor chip and a third substrate from a side surface of the second substrate;
- wherein a part of an area of the molding material corresponding to the first semiconductor chip is removed in a thickness direction from the surface thereof, and
- wherein one side of the first substrate protrudes from the second substrate to serve as an external connection terminal.
4 more elements
Dependencies are inferred from the claim text.