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US 8,786,063 B2Granted
Integrated circuit packaging system with leads and transposer and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto
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Abstract
A method of manufacture of an integrated circuit packaging system includes: conductively bonding a first surface of a transposer to an inner end of a lead separate from the transposer; conductively bonding a die to the first surface of the transposer; and encapsulating the inner end with a mold compound having a bottom mold surface that is exposed and is coplanar with a surface of the transposer opposite the first surface.
Claims10
An integrated circuit packaging system comprising:
- a transposer;
- an adhesive pad attached to the transposer, the adhesive pad in a form of a continuous ring;
- a lead having an inner end wire bonded to a first surface of the transposer, the inner end attached to the adhesive pad;
- a die conductively bonded to the first surface of the transposer, the die and the adhesive pad attached to the first surface;
- and
- a mold compound encapsulating the inner end, the mold compound having a bottom mold surface exposed and coplanar with a surface of the transposer opposite the first surface.
3 more elements
Dependencies are inferred from the claim text.