Semiconductor package integrated with conformal shield and antenna

A semiconductor package, comprising:

• a substrate;
• a semiconductor die disposed on the substrate;
• a package body encapsulating the semiconductor die and having an upper surface;
• an electromagnetic interference shield disposed directly on the upper surface of the package body;
• a dielectric structure covering the electromagnetic interference shield;
• an antenna formed on the dielectric structure;
• a feeding element connecting the antenna and a feeding point of the substrate;
• and
• a conductive via penetrating entirely through the dielectric structure connecting the antenna and the electromagnetic interference shield, forming an antenna grounding element wherein the feeding element penetrates the package body and the dielectric structure.

A semiconductor package, comprising:

• a substrate;
• a die disposed on the substrate;
• a package body encapsulating the die and having an upper surface;
• an electromagnetic interference shield comprising a film disposed directly onto the upper surface of the package body;
• a dielectric structure covering the electromagnetic interference shield;
• an antenna disposed on an upper surface of the dielectric structure;
• a feeding element connecting the antenna and a feeding point of the substrate;
• and
• a conductive via formed in the dielectric structure connecting the antenna and the electromagnetic interference shield, forming an antenna grounding element wherein the feeding element penetrates the package body and the dielectric structure.