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US 8,786,059 B2Granted
Passivation layer surface topography modifications for improved integrity in packaged assemblies
AssigneeInternational Business Machines Corporation
InventorsAlexandre Blander, Jon A Casey, Timothy H Daubenspeck, Ian D Melville, Jennifer V Muncy, Marie-Claude Paquet
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Abstract
A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.
Claims17
A structure comprising:
- a passivation layer over a base structure, said passivation layer comprising an organic polymer material and an adhesion promoter having a silicon-containing end;
- and
- a plurality of particles in said passivation layer comprising moisture bonded to said silicon-containing end of said adhesion promoter, wherein at least some of said plurality of particles are on a surface of said passivation layer and separated by a gap not containing said organic polymer material so that said surface of said passivation layer is a roughened surface.
Dependencies are inferred from the claim text.