Electronic device having MEMS element and resistive element

An electronic device comprising:

• a semiconductor substrate;
• a drive circuit provided on the semiconductor substrate;
• an insulating region including a first insulating part provided on the semiconductor substrate and comprising a plurality of interlayer insulating films, and a second insulating part provided on the first insulating part, the insulating region being configured to cover the drive circuit;
• an element for high-frequency, which is provided on the insulating region and which is driven by said drive circuit, and to which a high-frequency signal is applied;
• an interconnection including a first conductive part provided in the first insulating part, and a second conductive part provided in the second insulating part, the interconnection being configured to transmit a drive signal from the drive circuit to the element for high-frequency;
• and
• a resistive element provided between the second conductive part and the element for high-frequency, at a position closer to said element for high-frequency than the second conductive part.

An electronic device comprising:

• a semiconductor substrate;
• a drive circuit provided on the semiconductor substrate;
• an insulating region including a first insulating part provided on the semiconductor substrate and comprising a plurality of interlayer insulating films, and a second insulating part provided on the first insulating part, the insulating region being configured to cover said drive circuit;
• an element for high-frequency, which is provided on the insulating region and which is driven by said drive circuit, and to which a high-frequency signal is applied;
• an interconnection including a first conductive part provided in the first insulating part, and a second conductive part provided in the second insulating part, the interconnection being configured to transmit a drive signal from the drive circuit to the element for high-frequency;
• and
• a resistive element provided between the second conductive part and the element for high-frequency, the resistive element being electrically connected to the second conductive part and the element for high-frequency.