Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same

A method for forming a chip package, comprising:

• providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate;
• forming a through-hole in the substrate;
• forming an insulating layer on the substrate;
• forming a conducting layer on the insulating layer on the substrate, having a portion overlying both sidewalls and a bottom of the through-hole, wherein the conducting layer is electrically connected to the at least one optoelectronic device;
• forming a first light shielding layer on the second surface of the substrate and partially filling the through-hole with the first light shielding layer such that a void is formed between the bottom of the through-hole and the first light shielding layer in the through-hole;
• and
• forming a second light shielding layer on the first light shielding layer, wherein the second light shielding layer directly contacts with the first light shielding layer, and a contact interface is between the first light shielding layer and the second light shielding layer, and wherein the portion of the conducting layer, which overlies both sidewalls and the bottom of the through-hole, directly contacts the void.