Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof

A light emitting diode (LED), comprising:

• a phosphor sheet comprising a mounting area and a plurality of supporters protruding from a bottom surface of the mounting area;
• and
• an LED chip supported by the plurality of supporters such that a light emission surface of the LED chip is bonded to an inside of the mounting area with adhesive filled in the phosphor sheet at a height not exceeding a height of the plurality of supporters,
• wherein sidewalls of the LED chip are in contact with the mounting area.

A manufacturing method of a light emitting diode (LED) module, the manufacturing method comprising:

• manufacturing a plurality of LED chips which are separated from one another;
• manufacturing a phosphor pre-form comprising a plurality of mounting areas for mounting the plurality of LED chips and a plurality of protruding areas for dividing the plurality of mounting areas;
• applying adhesive in the phosphor pre-form;
• mounting each of the plurality of LED chips in a corresponding one of the plurality of mounting areas;
• cutting the phosphor pre-form in the plurality of protruding areas for dividing the plurality of mounting areas, into units including individual LED chips;
• and
• mounting the individual LED chips on a substrate,
• wherein sidewalls of each of the plurality of LED chips are in contact with the corresponding mounting area.