Organic light-emitting display apparatus and method of manufacturing the same

An organic light-emitting display apparatus, comprising:

• a planarization layer covering a plurality of thin film transistors;
• a plurality of via-holes comprising a groove portion which is formed by etching the planarization layer and a plurality of dummy via-holes which are spaced apart from the via-holes;
• a plurality of pixel electrodes, each comprising a light emission portion and a non-light emission portion, wherein the pixel electrodes are connected to one of the plurality of thin film transistors via the via-holes, and a via-hole area including a pair of via-hole and a dummy via-hole which are closest to each other is disposed at a distance furthest away from the light emission portion of each of the plurality of pixel electrodes which are adjacent to the via-hole area;
• a pixel-defining layer formed on the planarization layer so as to cover the via-holes, the dummy via-holes, and the non-light emission portion of the pixel electrodes;
• an organic layer disposed on the light emission portion and comprising an emissive layer;
• and
• an opposite electrode disposed on the organic layer.

A method of manufacturing an organic light-emitting display apparatus, the method comprising the steps of:

• preparing an acceptor substrate on which a planarization layer covering a plurality of thin film transistors is disposed;
• providing a plurality of pixel electrodes, each comprising a light emission portion and a non-light emission portion, wherein the light emission portions of the pixel electrodes are arranged on the planarization layer in a first grid pattern;
• providing a plurality of via-holes, each connecting one of the plurality of thin film transistors and one of the plurality of pixel electrodes through the planarization layer, the via-holes being arranged in a second grid pattern which is offset from the first grid pattern;
• providing a plurality of dummy via-holes which are respectively spaced apart from the plurality of via-holes;
• providing a pixel-defining layer (PDL) formed on the planarization layer so as to cover the via-holes, the dummy via-holes, and the non-light emission portion of the pixel electrodes;
• preparing a donor film on which a transfer layer is formed;
• aligning the transfer layer of the donor film and the light emission portion of the acceptor substrate so as to face each other;
• and
• transferring the transfer layer to the light emission portion by irradiating a laser onto the donor film.