Method for indexing dies comprising integrated circuits

An integrated circuit, comprising:

• a package;
• and
• a semiconductor die disposed within the package and including
• a first circuit having a first structure indicative of a region of a wafer and an electronic structure configured to store a value indicative of the region of the wafer corresponding to the die such that, when read, a first signal is generated corresponding to the region;
• and
• a first structure configured to identify a section of the region corresponding to the die.

A system, comprising:

• a first integrated circuit, comprising:
• a first package;
• and
• a first semiconductor die disposed within the package and including
• a first circuit having a first structure indicative of a region of a wafer and an electronic structure configured to store a value indicative of the region of the wafer corresponding to the die such that, when read, a first signal is generated corresponding to the region;
• and
• a first structure configured to identify a section of the region corresponding to the die;
• and
• a second integrated circuit coupled to the first integrated circuit.

A semiconductor die, comprising:

• a first physical index indicative of a position of a mask with respect to a wafer from which the die was obtained during manufacture of the die;
• a second physical index indicative of a position of the mask with respect to the die during manufacture of the die;
• and
• an electronic index configured to store information about the first and second physical indexes.