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US 8,785,821 B2Granted
Substrate processing apparatus with heater element held by vacuum
AssigneeSokudo Co., Ltd.
InventorHarald Herchen
Life of this patent
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Abstract
A substrate processing apparatus for heating a substrate is provided. The substrate processing apparatus can include a top and bottom planar member. A heater layer can be disposed between the top and the bottom planar member and held in place by evacuating a region between the two planar members. The heater layer can be made of alternating insulating and conducting layers with heater elements formed on the conducting layers in predetermined pattern.
Claims6
A substrate processing apparatus comprising:
- a first planar member;
- a second planar member disposed below the first planar member;
- an evacuated region between the first planar member and the second planar member, the evacuated region being characterized by vacuum;
- a heating layer disposed in the evacuated region, wherein the heating layer is coupled to a lower surface of the first planar member and an upper surface of the second planar member;
- and
- a first cooling member configured to travel in a vertical direction between a lower surface of the second planar member and an upper surface of a second cooling member, the second cooling member being disposed below the first cooling member, wherein an upper surface of the first cooling member is configured to contact the lower surface of the second planar member at a first position and a lower surface of the first cooling member is configured to contact the upper surface of the second cooling member at a second position.
3 more elements
Dependencies are inferred from the claim text.