Through wiring substrate and manufacturing method thereof
AssigneeFujikura Ltd.
InventorsSatoshi Yamamoto, Hirokazu Hashimoto
Life of this patent
Estimating the term…
Abstract
A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.
Claims3
A through wiring substrate comprising:
- a substrate having a first face and a second face;
- and
- a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole which penetrates between the first face and the second face
- and which has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and has a first liner part extending in a thickness direction of the substrate and a second linear part extending in a direction parallel with the first face of the substrate, wherein:
- the outer peripheral part is a quandrant of a circular arc part with a radius of R1, and the inner peripheral part is a quandrant of a circular arc part with a radius of r1;
- centers of the quardrant of the outer peripheral part and the quandrant of the inner peripheral part are at the same position;
- and
- a difference between R1 and r1 is equal to a diameter of the through-wire at least in one of the first linear part and the second linear part.
Dependencies are inferred from the claim text.