Printed circuit board and method for manufacturing the same

A printed circuit board (PCB) comprising:

• a base substrate;
• a circuit layer formed on the base substrate and including a connection pad;
• a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad;
• a metal post formed on upper portions of the exposed connection pad and the solder resist layer and having a plurality of diameters;
• and
• a seed layer formed on an upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post,
• wherein the metal post comprises:
• a first post portion formed within the opening;
• a second post portion formed on upper portions of the first post portion and the solder resist layer;
• and
• a third post portion formed on an upper portion of the second post portion,
• wherein, in the metal post, the diameter of the third post portion is smaller than that of the second portion, and
• wherein the seed layer is formed on a lower surface of the first portion, the second post portion, and the third post portion of the metal post, and the seed layer is formed to have at least two steps like stairs.