Wiring board with built-in electronic component and method for manufacturing the same

A wiring board with a built-in electronic component, comprising:

• a substrate having an opening portion and having a first surface and a second surface on an opposite side of the first surface;
• and
• an electronic component having a third surface and a fourth surface on an opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces a same direction as the first surface of the substrate, wherein
• the electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate is partially tapered and has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface, and
• the substrate has a thickness which is larger than a thickness of the electronic component, and the tapered surface is formed from the first surface to a deeper point than the third surface of the electronic component.