Wiring board and method of manufacturing the same

A wiring board comprising:

• a conductor layer;
• a solder resist layer comprised of thermosetting resin and laminated on the conductor layer, the solder resist layer defining a through-hole extending through the solder resist layer such that a portion of the conductor layer is located below the through-hole;
• and
• a conductor post comprised of tin, copper, or a solder that is electrically connected to the portion of the conductor layer below the through-hole, the conductor post including a lower conductor post and an upper conductor post located above the lower conductor post;
• wherein the
• lower conductor post is located within the through-hole and includes an external side surface with an external alloy layer comprised of copper and tin, and a lower end surface with a lower end alloy layer comprised of copper and tin;
• and
• wherein the upper conductor post projects outside the solder resist layer and
• at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer.