Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device

A thermosetting light-reflecting resin composition, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent, wherein:

• the white pigment (E) is a combination of inorganic hollow particles and at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, and zirconium oxide;
• the additive (F) includes a triblock copolymer which is a compound represented by formula (III):
• wherein
• l is an integer of 1 to 200,
• m1+m2 is an integer of 2 to 400,
• R1 is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms,
• R2 and R3 are independently selected from the group consisting of:
• a monovalent organic group having 1 to 10 carbon atoms including at least one of an alkyl group, an aryl group, an alkoxy group, and an epoxy group;
• a monovalent organic group having 1 to 10 carbon atoms including a carboxyl group;
• and a polyalkylene ether group having 3 to 500 carbon atoms, and
• R4 is selected from the group consisting of a divalent hydrocarbon group having 1 to 10 carbon atoms;
• the release agent (G) comprises a metallic soap which is a metal salt of a fatty acid selected from the group consisting of lauric acid, myristic acid, palmitic acid, stearic acid and montanoic acid;
• and
• the resin composition, after curing, has a diffuse reflectance of at least 80% at a light wavelength of 400 nm;
• and the resin composition is possible to perform transfer molding at least 100 times continuously.

A thermosetting light-reflecting resin composition, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent, wherein:

• the white pigment (E) is a combination of inorganic hollow particles and at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, and zirconium oxide;
• the additive (F) includes a triblock copolymer which is a compound represented by formula (III):
• wherein
• l is an integer of 1 to 200,
• m1+m2 is an integer of 2 to 400,
• R1 is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms,
• R2 and R3 are independently selected from the group consisting of:
• a monovalent organic group having 1 to 10 carbon atoms including at least one of an alkyl group, an aryl group, an alkoxy group, and an epoxy group;
• a monovalent organic group having 1 to 10 carbon atoms including a carboxyl group;
• and a polyalkylene ether group having 3 to 500 carbon atoms, and
• R4 is selected from the group consisting of a divalent hydrocarbon group having 1 to 10 carbon atoms;
• the release agent (G) comprises at least one compound selected from the group consisting of an aliphatic carboxylic acid, an aliphatic carboxylic acid ester, an aliphatic polyester, a non-oxidized polyolefin, and an oxidized polyolefin having a carboxyl group;
• and
• the resin composition, after curing, has a diffuse reflectance of at least 80% at a light wavelength of 400 nm;
• and the resin composition is possible to perform transfer molding at least 100 times continuously.