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US 8,785,522 B2Granted
Low-permittivity resin composition
AssigneeKao Corporation
InventorsToshihiro Yano, Masaki Komatsu
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AssigneeKao Corporation
InventorsToshihiro Yano, Masaki Komatsu
Estimating the term…
The present invention relates to a low-dielectric resin composition having sufficiently low dielectric constant and dissipation factor, a low-dielectric film formed of the low-dielectric resin composition, processes for producing the low-dielectric resin composition and the low-dielectric film, and a coating agent for low-dielectric films. According to the present invention, there are provided (1) a low-dielectric resin composition including hollow silica particles having an average particle size of from 0.05 to 3 μm and a BET specific surface area of less than 30 m2/g, and a matrix resin in which the hollow silica particles are dispersed; (2) a low-dielectric film including the low-dielectric resin composition; (3) a process for producing the low-dielectric resin composition which includes the steps of preparing hollow silica particles (A) containing air inside thereof or core/shell type silica particles (B) in which a material capable of being dissipated by calcination to form hollow portions therein is encapsulated; calcination the hollow silica particles (A) or the core/shell type silica particles (B) at a temperature higher than 950° C. to prepare hollow silica particles (C); and dispersing the hollow silica particles (C) in a matrix resin-forming material to prepare a dispersion of the particles; and (4) a coating agent for low-dielectric films including the hollow silica particles, and a matrix resin-forming material in which the hollow silica particles are dispersed.
A low-dielectric resin composition, comprising hollow silica particles having an average particle size of from 0.05 to 2.2 μm and a BET specific surface area of less than 30 m2/g, and a matrix resin in which the hollow silica particles are dispersed.
A low-dielectric resin composition comprising hollow silica particles having an average particle size of from 0.05 to 1 μm with the proviso that 80% by mass or more of the whole particles have a particle size falling within the range of the average particle size ±30%, and a BET specific surface area of less than 30 m2/g, and a matrix resin in which the hollow silica particles are dispersed.
A low-dielectric resin composition, comprising hollow silica particles having an average particle size of from 0.05 to 2.2 μm, a porosity of from 30 to 90% and a BET specific surface area of less than 30 m2/g, and a matrix resin in which the hollow silica particles are dispersed.
The low-dielectric resin composition according to 1, wherein a content of the hollow silica particles in the composition is from 10 to 60% by mass.
A coating agent for low-dielectric films, comprising hollow silica particles having an average particle size of from 0.05 to 2.2 μm and a BET specific surface area of less than 30 m2/g, and a matrix resin-forming material in which the hollow silica particles are dispersed.
A coating agent for low-dielectric films comprising hollow silica particles having an average particle size of from 0.05 to 1 μm with the proviso that 80% by mass or more of the whole particles have a particle size falling within the range of the average particle size ±30%, and a BET specific surface area of less than 30 m2/g, and a matrix resin-forming material in which the hollow silica particles are dispersed.
A coating agent for low-dielectric films, comprising hollow silica particles having an average particle size of from 0.05 to 2.2 μm, a porosity of from 30 to 90% and a BET specific surface area of less than 30 m2/g, and a matrix resin-forming material in which the hollow silica particles are dispersed.
Dependencies are inferred from the claim text.