Reacted conductive gate electrodes and methods of making the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMatthew T. Currie, Richard Hammond
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMatthew T. Currie, Richard Hammond
Estimating the term…
A semiconductor device and a method for fabricating a semiconductor device involve a semiconductor layer that includes a first material and a second material. The first and second materials can be silicon and germanium. A contact of the device has a portion proximal to the semiconductor layer and a portion distal to the semiconductor layer. The distal portion includes the first material and the second material. A metal layer formed adjacent to the relaxed semiconductor layer and adjacent to the distal portion of the contact is simultaneously reacted with the relaxed semiconductor layer and with the distal portion of the contact to provide metallic contact material.
A method for fabricating a semiconductor device, comprising:
A method comprising:
A method for fabricating a semiconductor device, comprising:
Dependencies are inferred from the claim text.