Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising:

• providing a support member;
• forming a removable layer on the support member;
• forming a first insulation layer on the removable layer;
• forming a penetrating hole which penetrates through the first insulation layer and reaches at least an intermediate point of the removable layer;
• forming a first conductive pattern on the first insulation layer;
• filling a plating material in the penetrating hole such that an electrode having a protruding portion protruding from a surface of the first insulation layer toward the intermediate point of the removable layer is formed in the penetrating hole;
• forming a second insulation layer on the first insulation layer such that the first conductive pattern is covered by the second insulation layer;
• forming on the second insulation layer a second conductive pattern configured to mount a semiconductor element;
• mounting a semiconductor element on the second conductive pattern;
• separating the support member from a structure comprising the removable layer, the first insulation layer, the first conductive pattern, the electrode, the second insulation layer, the second conductive pattern and the semiconductor element;
• and
• removing the removable layer from the first insulation layer such that the protruding portion of the electrode protrudes from the surface of the first insulation layer.