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US 8,785,252 B2Granted
Resin sealed semiconductor device and manufacturing method therefor
AssigneeMitsubishi Electric Corporation
InventorsMasafumi Matsumoto, Tatsuya Iwasa, Junji Yamada, Masaru Furukawa
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Abstract
A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case.
Claims6
A method for manufacturing a semiconductor device, comprising:
- mounting a metal terminal on a thermoplastic resin case at a predetermined location such that a portion of said metal terminal is in contact with said thermoplastic resin case;
- heating said mounted metal terminal by induction heating to a temperature higher than the melting point of said thermoplastic resin case so that said portion of said metal terminal is thermoplastically bonded to said thermoplastic resin case;
- mounting a semiconductor chip within said thermoplastic resin case;
- and
- connecting said bonded metal terminal to said semiconductor chip by wire bonding,
- wherein said metal terminal has a wire bonding surface and an opposing contact surface, said portion of said metal terminal thermoplastically bonded to said thermoplastic resin case including the opposing contact surface of said metal terminal.
3 more elements
Dependencies are inferred from the claim text.