Methods and apparatus for flip-chip-on-lead semiconductor package

An article, comprising:

• a generally planar leadframe having a through hole;
• a generally planar die having a first surface with an active area, the die coupled to the leadframe by an adhesive on the first surface;
• a reflowed solder ball disposed in the through hole to form a connection between the active area and the leadframe;
• and
• first and second non-conductive filler elements having the same size disposed in the adhesive,
• wherein the die and the leadframe are spaced at an equal distance from each other at locations of the first and second non-conductive filler elements, wherein the distance corresponds to the size of the first and second non-conductive filler elements.

A device, comprising:

• a semiconductor package, including:
• a leadframe having a through hole;
• a die having an active area, the die coupled to the leadframe by an adhesive on the same side of the die as the active area;
• a reflowed solder ball disposed in the through hole to form a connection between the active area and the leadframe;
• and
• first and second non-conductive filler elements having the same size disposed in the adhesive,
• wherein the die and the leadframe are spaced at an equal distance from each other at locations of the first and second non-conductive filler elements, wherein the distance corresponds to the size of the first and second non-conductive filler elements.