Method of manufacturing stack type semiconductor package

A method of manufacturing a stack type semiconductor package, comprising:

• providing a lower semiconductor package comprising a circuit board comprising an upper surface to which a semiconductor chip is adhered and on which a plurality of electrode pads are positioned;
• fixing a plurality of metal pins to the circuit board using a jig comprising a metal plate and a plurality of holes formed in the metal plate, wherein the holes are positioned to correspond to a same arrangement by which the electrode pads of the circuit board are positioned, positioning the metal pins in the holes, stacking the jig including the meal pins on the circuit board, wherein the metal pins are positioned on the circuit board to correspond to the same arrangement by which the electrode pads are positioned, and wherein the metal plate comprises an upper surface and a lower surface, the lower surface faces the upper surface of the lower semiconductor package and the metal pins protrude from the upper surface of the metal plate, and separating the metal plate from the metal pins and the circuit board;
• and
• vertically stacking an upper semiconductor package on the metal pins, such that the upper surface of the lower semiconductor package and the lower surface of the metal plate are adjacent to each other, wherein the upper semiconductor package is electrically connected to the metal pins.

A method of manufacturing a stack type semiconductor package, comprising:

• providing a lower semiconductor package comprising a circuit board comprising an upper surface to which a semiconductor chip is adhered and on which a plurality of electrode pads are positioned;
• forming conductive adhesive layers respectively on the electrode pads of the circuit board;
• providing a jig comprising a metal plate and holes formed in the metal plate, wherein the holes are positioned to correspond to the same arrangement by which the electrode pads of the circuit board are positioned, and wherein the metal plate comprises an upper surface and a lower surface, the lower surface faces the upper surface of the lower semiconductor package;
• positioning metal pins in the holes, wherein the metal pins protrude from the upper surface of the metal plate;
• stacking the jig comprising the metal pins on the conductive adhesive layers, wherein the metal pins are positioned to correspond to the same arrangement by which the electrode pads are positioned, such that the upper surface of the lower semiconductor package and the lower surface of the metal plate are adjacent to each other;
• reflowing the conductive adhesive layers;
• separating the metal plate of the jig from the circuit board to form the metal pins on the circuit board, wherein the metal pins are positioned to correspond to the same arrangement by which the electrode pads are positioned, and wherein the protruded metal pins pass through the upper and lower surfaces of the metal plate as the jig is separated;
• and
• vertically stacking an upper semiconductor package on the metal pins, wherein the upper semiconductor package is electrically connected to the metal pins.

A method of manufacturing a stack type semiconductor package, comprising:

• providing a lower semiconductor package comprising a circuit board having an upper surface on which a plurality of electrode pads are positioned;
• providing a jig comprising a metal plate and holes formed in the metal plate, wherein the holes are spaced apart from each other at a predetermined pitch, and wherein the metal plate comprises an upper surface and a lower surface, the lower surface faces the upper surface of the lower semiconductor package and metal pins protrude from the upper surface of the metal plate;
• positioning the metal pins in the holes;
• stacking the jig comprising the metal pins on the circuit board, such that the upper surface of the lower semiconductor package and the lower surface of the metal plate are adjacent to each other;
• separating the metal plate of the jig from the circuit hoard to form the metal pins on the circuit board, wherein the protruded metal pins pass through the upper and lower surfaces of the metal plate as the jig is separated, and wherein the metal pins are spaced apart from each other at the predetermined pitch;
• and
• vertically stacking an upper semiconductor package on the metal pins, wherein the upper semiconductor package is electrically connected to the metal pins via a plurality of connection terminals spaced apart from each other at the predetermined pitch.