Apparatus and method for producing solar cells

A method of forming a solar cell, comprising:

• disposing a plurality of substrates about a plurality of surfaces of a substrate apparatus that is operatively coupled to rotate within a vacuum chamber;
• rotating the substrate apparatus;
• forming an absorber monolayer over a surface of each one of the plurality of substrates, the step of forming comprising:
• depositing a plurality of copper and gallium atoms over at least a portion of the surface of each one of the plurality of substrates using a first sputtering source;
• depositing a plurality of selenium atoms over at least a portion of the surface using an evaporation source;
• depositing a plurality of indium atoms over at least a portion of the surface of each one of the plurality of substrates using a second sputtering source;
• and
• reacting the plurality of copper, gallium, and indium atoms with the plurality of selenium atoms to form the absorber monolayer;
• and
• repeating the step of forming to form an absorber layer.

An apparatus for forming a solar cell, comprising:

• a housing defining a vacuum chamber;
• a rotatable substrate apparatus configured to hold a plurality of substrates on a plurality of surfaces wherein each of the plurality of surfaces are disposed facing an interior surface of the vacuum chamber;
• a first sputtering source configured to deposit a plurality of copper and gallium atoms over at least a portion of the surface of each one of the plurality of substrates;
• an evaporation source disposed in a first subchamber of the vacuum chamber and configured to deposit a plurality of selenium atoms over at least a portion of the surface of each one of the plurality of substrates;
• a second sputtering source configured to deposit a plurality of indium atoms over at least a portion of the surface of each one of the plurality of substrates;
• a third sputtering source disposed in a second subchamber of the vacuum chamber and configured to deposit a buffer layer over the surface of each one of the plurality of substrates;
• and
• an evacuation source configured to evacuate atoms from the vacuum chamber to prevent contamination of the first and second sputtering sources.