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US 8,784,975 B2Granted
Self-aligned wafer bonding
AssigneeSeagate Technology LLC
InventorsJun Zheng, Dadi Setiadi
Life of this patent
Estimating the term…
Abstract
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.
Claims14
A wafer apparatus comprising:
- a first wafer comprising a first substrate and two or more first hydrophilic areas disposed on the first substrate, first hydrophobic areas surrounding the first hydrophilic areas, and a first eutectic bonding material disposed on the first substrate;
- a second wafer comprising a second substrate and two or more second hydrophilic areas disposed on the second substrate, second hydrophobic areas surrounding the second hydrophilic areas, and a second eutectic bonding material disposed on the second substrate and bonded with the first eutectic bonding material, the first hydrophilic areas aligned with and facing the second hydrophilic areas.
A wafer apparatus comprising:
- a first wafer comprising a first substrate and two or more first hydrophilic areas disposed on the first substrate, first hydrophobic areas surrounding the first hydrophilic areas, and a first eutectic bonding material disposed on the first substrate;
- a second wafer comprising a second substrate and two or more second hydrophilic areas disposed on the second substrate, second hydrophobic areas surrounding the second hydrophilic areas, and a second eutectic bonding material disposed on the second substrate, the first hydrophilic areas aligned with and facing the second hydrophilic areas.
Dependencies are inferred from the claim text.