A conductive pattern comprising a receiving substrate comprising a support and a receiving layer provided onto part of or an entire surface of the support, wherein the receiving layer is formed by using a resin composition containing a urethane resin (A) having an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg and a hydrophilic group, a vinyl polymer (B), and an aqueous medium (C), wherein the conductive pattern is produced by performing printing on the receiving layer with a fluid composed of a conductive ink containing a conductive substance, or a plating nucleus agent containing a conductive substance.