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US 8,784,952 B2Granted
Method of forming a conductive image on a non-conductive surface
AssigneeEarthone Circuit Technologies Corporation
InventorWilliam Wismann
Life of this patent
Estimating the term…
Abstract
The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.
Claims15
An analog circuit fabricated using a method comprising the steps of:
- activating at least a portion of a non-conductive substrate surface;
- depositing a metal coordination complex on a part of the activated portion of the surface;
- subjecting the metal coordination complex that is located on the part of the activated portion of the surface to a magnetic field to align molecules of the metal coordination complex with the magnetic field and thereby more deeply injecting the metal coordination complex into the nonconductive substrate than would occur in the step of depositing the metal coordination complex;
- exposing the metal coordination complex to electromagnetic radiation;
- reducing the metal coordination complex to elemental metal;
- removing unreduced metal coordination complex from the surface;
- drying the surface;
- and
- depositing a conductive material onto the surface.
6 more elements
A digital circuit fabricated using a method comprising the steps of:
- activating at least a portion of a non-conductive substrate surface;
- depositing a metal coordination complex on a part of the activated portion of the surface;
- subjecting the metal coordination complex that is located on the part of the activated portion of the surface to a magnetic field to align molecules of the metal coordination complex with the magnetic field and thereby more deeply injecting the metal coordination complex into the nonconductive substrate than would occur in the step of depositing the metal coordination complex;
- exposing the metal coordination complex to electromagnetic radiation;
- reducing the metal coordination complex to elemental metal;
- removing unreduced metal coordination complex from the surface;
- drying the surface;
- and
- depositing a conductive material onto the surface.
6 more elements
A mixed-signal circuit fabricated using a method comprising the steps of:
- activating at least a portion of a non-conductive substrate surface;
- depositing a metal coordination complex on a part of the activated portion of the surface;
- subjecting the metal coordination complex that is located on the part of the activated portion of the surface to a magnetic field to align molecules of the metal coordination complex with the magnetic field and thereby more deeply injecting the metal coordination complex into the nonconductive substrate than would occur in the step of depositing the metal coordination complex;
- exposing the metal coordination complex to electromagnetic radiation;
- reducing the metal coordination complex to elemental metal;
- removing unreduced metal coordination complex from the surface;
- drying the surface;
- and
- depositing a conductive material onto the surface.
6 more elements
An RF circuit fabricated using a method comprising the steps of:
- activating at least a portion of a non-conductive substrate surface;
- depositing a metal coordination complex on a part of the activated portion of the surface;
- subjecting the metal coordination complex that is located on the part of the activated portion of the surface to a magnetic field to align molecules of the metal coordination complex with the magnetic field and thereby more deeply injecting the metal coordination complex into the nonconductive substrate than would occur in the step of depositing the metal coordination complex;
- exposing the metal coordination complex to electromagnetic radiation;
- reducing the metal coordination complex to elemental metal;
- removing unreduced metal coordination complex from the surface;
- drying the surface;
- and
- depositing a conductive material onto the surface.
6 more elements
A substrate fabricated using a method comprising the steps of:
- activating at least a portion of a non-conductive substrate surface;
- depositing a metal coordination complex on a part of the activated portion of the surface;
- subjecting the metal coordination complex that is located on the part of the activated portion of the surface to a magnetic field to align molecules of the metal coordination complex with the magnetic field and thereby more deeply injecting the metal coordination complex into the nonconductive substrate than would occur in the step of depositing the metal coordination complex;
- exposing the metal coordination complex to electromagnetic radiation;
- reducing the metal coordination complex to elemental metal;
- removing unreduced metal coordination complex from the surface;
- drying the surface;
- and
- depositing a conductive material onto the surface.
6 more elements
Dependencies are inferred from the claim text.