Thermosetting composition and printed circuit board using the same

A thermosetting composition comprising:

• a liquid crystal oligomer;
• a bismaleimide-based compound;
• an epoxy compound;
• and a fluorinated polymer resin powder,
• wherein the liquid crystal oligomer comprises a backbone represented by the following Chemical Formula 1:
• wherein, in Chemical Formula 1, R1 is represented by the following Chemical Formula 2, R2 is represented by the following Chemical Formula 6, and n and m are independently integers of from 1 to 100:
• *—X1—Ar1—Y1—* Chemical Formula 2
• wherein, in Chemical Formula 2, X1 and Y1 are independently O, NR″, or C(═O), where R″ is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C6 to C30 aryl group,
• Ar1 includes a divalent aromatic organic group or aliphatic cyclic group represented by any of the following Chemical Formula 3-1 to 3-11, where at least one hydrogen in the cycle group is substituted or unsubstituted:
• wherein, in Chemical Formula 3-5 and 3-10, A1 is a single bond, a divalent heteroatom group, or a divalent aliphatic organic group, aromatic organic group, or a combination comprising at least one of the foregoing:
• *—X2—Ar3—Y2—* Chemical Formula 6
• wherein, in Chemical Formula 6, X2 and Y2 are independently O, NR″, or C(═O), where R″ is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination comprising at least one of the foregoing, and
• Ar3 includes at least one of a divalent aromatic organic group, aliphatic cyclic group, or a combination comprising at least one of the foregoing represented by any of the following Chemical Formula 7-1 to7-9:
• wherein, in Chemical Formula 7-5, A2 is a divalent heteroatom group, aliphatic organic group, aromatic organic group, or a combination comprising at least one of the foregoing, and wherein, in Chemical Formulae 7-6, 7-7, 7-8, and 7-9, Rc and Rd are independently a C1 to C5 alkyl group or a halogen.