Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board

A method of manufacturing a wiring board, wherein the wiring board comprises:

• a resin board treated with an ozone solution, the resin board comprising a mixture of a plurality of types of resins, the mixture containing an aromatic cyanate compound and an aromatic epoxy resin,
• a resin-metal composite layer which is formed integrally on a surface of the resin board and in which fine metal particles are uniformly dispersed in a resin matrix;
• and
• a wiring portion that comprises a plating film formed in a predetermined pattern on the resin-metal composite layer, wherein
• the resin-metal composite layer has a thickness of 10 to 200 nm and the wiring portion includes a fine wiring pattern having L/S =10/10 μm or less,
• the method comprising:
• an ozone treatment step of treating the resin board with the ozone solution so as to form a reformed layer having polar groups on a surface thereof;
• an adsorption step of bringing the reformed layer into contact with a metal compound solution so that at least one of colloidal particles and ions of a catalyst metal are attached to the polar groups and fine particles of the catalyst metal are dispersed in the reformed layer, thereby forming the resin-metal composite layer;
• and
• a plating step of performing a plating process on the resin-metal composite layer so as to form the wiring portion;
• a heat treating step of heating the resin board;
• and
• an etching step of removing an unnecessary portion of the resin-metal composite layer other than the wiring portion, wherein
• the ozone treatment step, the adsorption step and the plating step, the heat treatment step, and the etching step are carried out in the order of description.